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Measuring film thickness below 10 micrometers

Testing the bonding strength between ceramic and copper on ceramic circuit boards under thermal shock, and whether the substrate has cracked

Surface roughness measuring instrument

It mainly consists of a micro-cantilever with a needle tip, a micro-cantilever motion detection device, a feedback loop that monitors its motion, a piezoelectric ceramic scanner that scans the sample, and a computer-controlled image acquisition, display and processing system. Used to detect the surface roughness of materials.

Artificial intelligence appearance inspection

Used to detect the filling status of the plated through holes on the substrate.

1 Nikon microscope (stereomicroscope)
2 Leica REICHERT POLYVAR 2 MET
3 High-resolution microscope

Exposure front and back deviation inspection

Used for material aging testing, simulating the changes in material performance caused by sunlight, temperature, and humidity on the substrate, such as fading, yellowing, and embrittlement

Can efficiently detect the contours and surface shape dimensions, angles, and positions of various complex precision parts, and perform microscopic inspection and quality control.

Can perform metal element analysis based on the absorption of characteristic radiation by the ground state atomic vapor of a substance. It can sensitively and reliably measure trace or trace elements.

Used for preheating and heating treatment of circuit boards. Check whether the sample board has delamination, falling off, abnormal resistance value and other phenomena under high temperature for a long time.